Intel
Job Description
Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow’s technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower peoples digital lives. Do you love to solve technical challenges that no one has solved yet? Do you enjoy working with cross functional teams to deliver IP solutions for products that impact customers lives? If so, come join us to do something wonderful.
We are growing our team that drives wafer level assembly technology development in the Ronler Acres campus in Hillsboro, Oregon. We are a technology development organization developing future generations of heterogenous integrated packaging process technologies through innovation, product enhancement, as well as developing and enabling equipment and process capabilities.
We are looking for world class engineers to help us build the future of technology.
Engineering Interns provide project management, package design/development and sustaining support for integrated circuit or semiconductor processes.
Responsibilities will include, but not be limited to:
Assembly processes and/or equipment development and applying novel concepts in ball attach technology solutions for next-generation CPUs and devices.
Develop innovative solutions to enable Intel’s roadmap of future assembly packaging platform technologies.
Develop processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
Innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.
Process and equipment specification development, applying principles for design of experiments and data analysis, and planning and documentation of improvements through the white paper process.
Developing solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools.
Responsibilities may be quite diverse of a technical nature.
Length of internship will be discussed during the interview process, and usually are 3-9 months.
In addition to the qualifications listed below, the ideal candidate will also demonstrate the following traits:
Excellent written and communication skills
Works well independently and develops quick engineering solutions for complex problems
Skilled at interfacing with engineers and managers and partnering with stakeholder
High problem-solving skills, critical thinking, and good tolerance for ambiguity
Knows how to prioritize tasks independently
Natural focus on safety, quality, discipline, and accurate results for engineering customers
Contributes and works well in a multi-site team setting
Qualifications
You must possess the below requirements to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.
Minimum Qualifications:
Candidate must be pursuing a master’s degree or PhD degree in Mechanical Engineering or Material Science Engineering or Electrical Engineering, or Physics, or Chemistry or Optical Engineering or Polymer Science and Engineering or related field.
Preferred Qualifications:
6+ months of experience in fundamental science and engineering concepts in development to create novel solutions, including knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
Inside this Business Group
As the world’s largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art — from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore‡s Law to bring smart, connected devices to every person on Earth.